High Temperature Electronics > Technical Capabilities

HTE Technology and Capabilities - Technical Capabilities

Our technical capabilities include:

High Temperature Electronic Packaging (-55°C to 250°C)
RF Electrical Design
Substrate and PCB Layout Design for Hi-Rel applications
Custom Metal and Ceramic (HTCC, LTCC) Package Design
Multi-layer Thick-Film Substrate Fabrication (Al2O3, AlN, BeO)
Hybrid Microcircuit Assembly and Test in Class 10K clean room environment
CSP, Flip Chip & BGA Component Mounting
Hermetic Package Sealing for Hi-Rel applications (Projection, Seam and Cold welds)
Bare Die Procurement and Handling
Quartz BAW Resonator Design & Fabrication (Round, Strip and HFF Inverted Mesa configurations)
SAW Wafer Fabrication in Class 100 clean room environment
Wafer deep etching technology for Wafer Level Packaging
Process and Test Equipment Design
Environmental MIL-PRF Screening
Custom Process Equipment Design
Physical Design Modeling and Finite Element Analysis

Finite Element Analysis